JPH0727628Y2 - ウエハ保持治具 - Google Patents
ウエハ保持治具Info
- Publication number
- JPH0727628Y2 JPH0727628Y2 JP1989133865U JP13386589U JPH0727628Y2 JP H0727628 Y2 JPH0727628 Y2 JP H0727628Y2 JP 1989133865 U JP1989133865 U JP 1989133865U JP 13386589 U JP13386589 U JP 13386589U JP H0727628 Y2 JPH0727628 Y2 JP H0727628Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- diameter
- dedicated
- recess
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012546 transfer Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 210000000078 claw Anatomy 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000009751 slip forming Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 129
- 238000012545 processing Methods 0.000 description 37
- 239000000463 material Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133865U JPH0727628Y2 (ja) | 1989-11-20 | 1989-11-20 | ウエハ保持治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133865U JPH0727628Y2 (ja) | 1989-11-20 | 1989-11-20 | ウエハ保持治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0373452U JPH0373452U (en]) | 1991-07-24 |
| JPH0727628Y2 true JPH0727628Y2 (ja) | 1995-06-21 |
Family
ID=31681251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989133865U Expired - Lifetime JPH0727628Y2 (ja) | 1989-11-20 | 1989-11-20 | ウエハ保持治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727628Y2 (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1691406B1 (en) * | 2004-09-27 | 2013-11-13 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing equipment and semiconductor manufacturing method |
| JP5621142B2 (ja) * | 2013-04-02 | 2014-11-05 | 独立行政法人産業技術総合研究所 | 半導体プロセス用キャリア |
| JP5959069B2 (ja) * | 2014-07-14 | 2016-08-02 | 国立研究開発法人産業技術総合研究所 | 半導体プロセス用キャリア |
| JP6580544B2 (ja) * | 2016-10-20 | 2019-09-25 | エーエスエムエル ネザーランズ ビー．ブイ． | 基板支持ユニット上に基板を位置合わせする方法および装置 |
| US10133186B2 (en) | 2016-10-20 | 2018-11-20 | Mapper Lithography Ip B.V. | Method and apparatus for aligning substrates on a substrate support unit |
| JP7539843B2 (ja) * | 2021-01-19 | 2024-08-26 | 株式会社アドバンテスト | プローブカード及び電子部品試験装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02108331U (en]) * | 1989-02-15 | 1990-08-29 |
-
1989
- 1989-11-20 JP JP1989133865U patent/JPH0727628Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0373452U (en]) | 1991-07-24 |
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